BYCHIPS is the stocking distributor for LCA129, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LCA129 by email, we will give you a best price according your plan.
Buy LCA129 with BYCHPS
Buy with guarantee
LCA129
- Part Number:
- LCA129
- Manufacturer:
- IXYS Integrated Circuits Division
- Description:
- RELAY OPTOMOS 170MA SP-NO 6-DIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18793 Pieces
- Data sheet:
- LCA129.pdf
Introduction
Specifications
| Voltage - Load: | 0 ~ 250 V |
|---|---|
| Voltage - Input: | 1.2VDC |
| Termination Style: | PC Pin |
| Supplier Device Package: | 6-DIP |
| Series: | LCA, OptoMOS® |
| Relay Type: | Relay |
| Packaging: | Tube |
| Package / Case: | 6-DIP (0.300", 7.62mm) |
| Output Type: | AC, DC |
| On-State Resistance (Max): | 20 Ohm |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | LCA129 |
| Load Current: | 170mA |
| Expanded Description: | Solid State Relay SPST-NO (1 Form A) 6-DIP (0.300", 7.62mm) |
| Description: | RELAY OPTOMOS 170MA SP-NO 6-DIP |
| Circuit: | SPST-NO (1 Form A) |
| Email: | [email protected] |
Related parts for LCA129
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers