BYCHIPS is the stocking distributor for LAE3-35EA-6LFN672E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LAE3-35EA-6LFN672E by email, we will give you a best price according your plan.
Buy LAE3-35EA-6LFN672E with BYCHPS
Buy with guarantee
LAE3-35EA-6LFN672E
- Part Number:
- LAE3-35EA-6LFN672E
- Manufacturer:
- Lattice Semiconductor
- Description:
- IC FPGA 310 I/O 672FBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15096 Pieces
- Data sheet:
- LAE3-35EA-6LFN672E.pdf
Introduction
Specifications
| Voltage - Supply: | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits: | 1358848 |
| Supplier Device Package: | 672-FPBGA (27x27) |
| Series: | LA-ECP3 |
| Package / Case: | 672-BBGA |
| Operating Temperature: | -40°C ~ 125°C (TJ) |
| Number of Logic Elements/Cells: | 33000 |
| Number of LABs/CLBs: | 4125 |
| Number of I/O: | 310 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | LAE3-35EA-6LFN672E |
| Description: | IC FPGA 310 I/O 672FBGA |
| Email: | [email protected] |
Related parts for LAE3-35EA-6LFN672E
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers