BYCHIPS is the stocking distributor for IXXN200N60B3H1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IXXN200N60B3H1 by email, we will give you a best price according your plan.
Buy IXXN200N60B3H1 with BYCHPS
Buy with guarantee
IXXN200N60B3H1
- Part Number:
- IXXN200N60B3H1
- Manufacturer:
- IXYS Corporation
- Description:
- IGBT 600V 200A SOT-227
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18274 Pieces
- Data sheet:
- IXXN200N60B3H1.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 1.7V @ 15V, 100A |
| Supplier Device Package: | SOT-227B |
| Series: | GenX3™, XPT™ |
| Power - Max: | 780W |
| Package / Case: | SOT-227-4, miniBLOC |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | IXXN200N60B3H1 |
| Input Capacitance (Cies) @ Vce: | 9.97nF @ 25V |
| Input: | Standard |
| IGBT Type: | PT |
| Expanded Description: | IGBT Module PT Single 600V 200A 780W Chassis Mount SOT-227B |
| Description: | IGBT 600V 200A SOT-227 |
| Current - Collector Cutoff (Max): | 50µA |
| Current - Collector (Ic) (Max): | 200A |
| Configuration: | Single |
| Email: | [email protected] |
Related parts for IXXN200N60B3H1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IXXN200N60B3 | IXYS | IGBT 600V 280A SOT-227 | Inquiry |
|
IXXN200N60C3H1 | IXYS | IGBT 600V 200A SOT-227 | Inquiry |
|
MIXA30W1200TED | IXYS | IGBT MODULE 1200V 30A | Inquiry |
 |
BSM150GB170DN2HOSA1 | Infineon Technologies | MODULE IGBT 1700V | Inquiry |
 |
APTGL90DH120T3G | Microsemi Corporation | MOD IGBT 1200V 110A SP3 | Inquiry |
 |
APT50GF60JCU2 | Microsemi Corporation | MOD IGBT NPT SIC CHOPPER SOT227 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers