BYCHIPS is the stocking distributor for IS65C1024AL-45QLA3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IS65C1024AL-45QLA3 by email, we will give you a best price according your plan.
Buy IS65C1024AL-45QLA3 with BYCHPS
Buy with guarantee
IS65C1024AL-45QLA3
- Part Number:
- IS65C1024AL-45QLA3
- Manufacturer:
- ISSI (Integrated Silicon Solution, Inc.)
- Description:
- IC SRAM 1MBIT 45NS 32SOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18166 Pieces
Introduction
Specifications
| Voltage - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 32-SOP |
| Speed: | 45ns |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 32-SOIC (0.445", 11.30mm Width) |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Memory Type: | Volatile |
| Memory Size: | 1Mb (128K x 8) |
| Memory Format: | SRAM |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | IS65C1024AL-45QLA3 |
| Interface: | Parallel |
| Description: | IC SRAM 1MBIT 45NS 32SOP |
| Email: | [email protected] |
Related parts for IS65C1024AL-45QLA3
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IS65C1024AL-45TLA3 | ISSI, Integrated Silicon Solution Inc | IC SRAM 1MBIT 45NS 32TSOP | Inquiry |
|
IS65C1024AL-45TLA3-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 1MBIT 45NS 32TSOP | Inquiry |
 |
IS65C1024AL-45QLA3-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 1MBIT 45NS 32SOP | Inquiry |
 |
IS65C256AL-25ULA3-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 256KBIT 25NS 28SOP | Inquiry |
 |
IS65C256AL-25TLA3 | ISSI, Integrated Silicon Solution Inc | IC SRAM 256KBIT 25NS 28TSOP | Inquiry |
|
IS65C256AL-25ULA3 | ISSI, Integrated Silicon Solution Inc | IC SRAM 256KBIT 25NS 28SOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers