BYCHIPS is the stocking distributor for IRG5U75HF06A, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IRG5U75HF06A by email, we will give you a best price according your plan.
Buy IRG5U75HF06A with BYCHPS
Buy with guarantee
IRG5U75HF06A
- Part Number:
- IRG5U75HF06A
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- MOD IGBT 600V 75A POWIR 34
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13025 Pieces
- Data sheet:
- IRG5U75HF06A.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.9V @ 15V, 75A |
| Supplier Device Package: | POWIR® 34 |
| Series: | - |
| Power - Max: | 330W |
| Package / Case: | POWIR® 34 Module |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IRG5U75HF06A |
| Input Capacitance (Cies) @ Vce: | 4.3nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Expanded Description: | IGBT Module Half Bridge 600V 100A 330W Chassis Mount POWIR® 34 |
| Description: | MOD IGBT 600V 75A POWIR 34 |
| Current - Collector Cutoff (Max): | 1mA |
| Current - Collector (Ic) (Max): | 100A |
| Configuration: | Half Bridge |
| Email: | [email protected] |
Related parts for IRG5U75HF06A
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers