BYCHIPS is the stocking distributor for IRG4PC50UPBF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IRG4PC50UPBF by email, we will give you a best price according your plan.
Buy IRG4PC50UPBF with BYCHPS
Buy with guarantee
IRG4PC50UPBF
- Part Number:
- IRG4PC50UPBF
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IGBT 600V 55A 200W TO247AC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12520 Pieces
- Data sheet:
- IRG4PC50UPBF.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2V @ 15V, 27A |
| Test Condition: | 480V, 27A, 5 Ohm, 15V |
| Td (on/off) @ 25°C: | 32ns/170ns |
| Switching Energy: | 120µJ (on), 540µJ (off) |
| Supplier Device Package: | TO-247AC |
| Series: | - |
| Power - Max: | 200W |
| Packaging: | Bulk |
| Package / Case: | TO-247-3 |
| Other Names: | *IRG4PC50UPBF 63-6002PBF 63-6002PBF-ND SP001547878 |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | IRG4PC50UPBF |
| Input Type: | Standard |
| IGBT Type: | - |
| Gate Charge: | 180nC |
| Expanded Description: | IGBT 600V 55A 200W Through Hole TO-247AC |
| Description: | IGBT 600V 55A 200W TO247AC |
| Current - Collector Pulsed (Icm): | 220A |
| Current - Collector (Ic) (Max): | 55A |
| Email: | [email protected] |
Related parts for IRG4PC50UPBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers