BYCHIPS is the stocking distributor for IRAMS10UP60B, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IRAMS10UP60B by email, we will give you a best price according your plan.
Buy IRAMS10UP60B with BYCHPS
Buy with guarantee
IRAMS10UP60B
- Part Number:
- IRAMS10UP60B
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- PLUG N DRIVE INTELLIGENT PWR MOD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13485 Pieces
- Data sheet:
- IRAMS10UP60B.pdf
Introduction
Specifications
| Voltage - Isolation: | 2000Vrms |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | iMOTION™ |
| Package / Case: | 23-PowerSIP Module, 19 Leads, Formed Leads |
| Other Names: | *IRAMS10UP60B SP001540288 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IRAMS10UP60B |
| Expanded Description: | Power Driver Module IGBT 3 Phase 600V 10A 23-PowerSIP Module, 19 Leads, Formed Leads |
| Description: | PLUG N DRIVE INTELLIGENT PWR MOD |
| Current: | 10A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for IRAMS10UP60B
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IRAMS10UP60B-3 | Infineon Technologies | IC PWR MOD PLUG-N-DRIVE 600V 10A | Inquiry |
 |
IRAMS10UP60A | Infineon Technologies | IC MOD PWR INTELLIGENT 10A 600V | Inquiry |
 |
IRAMS10UP60A-2 | Infineon Technologies | IC PWR MOD PLUG-N-DRIVE 600V 10A | Inquiry |
 |
IRAMS10UP60B-2 | Infineon Technologies | IC PWR MOD PLUG-N-DRIVE 600V 10A | Inquiry |
 |
IRAMS10UP60B-S | Infineon Technologies | IC MOD PWR HYBRID 600V 10A | Inquiry |
|
IRAMS10UP60B-W | Infineon Technologies | IC MOD PWR HYBRID 600V 10A | Inquiry |
|
IRAMS10UP60B-4 | Infineon Technologies | IC PWR MOD PLUG-N-DRIVE 600V 10A | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers