BYCHIPS is the stocking distributor for IRAM336-025SB3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IRAM336-025SB3 by email, we will give you a best price according your plan.
Buy IRAM336-025SB3 with BYCHPS
Buy with guarantee
IRAM336-025SB3
- Part Number:
- IRAM336-025SB3
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IC HYBRID MULTI-CHIP 500V 2A
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12656 Pieces
- Data sheet:
- IRAM336-025SB3.pdf
Introduction
Specifications
| Voltage - Isolation: | - |
|---|---|
| Voltage: | 500V |
| Type: | MOSFET |
| Series: | - |
| Package / Case: | 19-PowerSSIP Module, Formed Leads |
| Other Names: | SP001544658 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IRAM336-025SB3 |
| Expanded Description: | Power Driver Module MOSFET 3 Phase 500V 2A 19-PowerSSIP Module, Formed Leads |
| Description: | IC HYBRID MULTI-CHIP 500V 2A |
| Current: | 2A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for IRAM336-025SB3
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IRAM336-025SB | Infineon Technologies | IC HYBRID 3PH INV 2A 500V SIP-S | Inquiry |
 |
IKCM15F60GAXKMA1 | Infineon Technologies | IFPS MODULES | Inquiry |
 |
PS21997-4A | Powerex Inc. | MOD DIPIPM 30A 600V SUPER MINI | Inquiry |
 |
PSS30S71F6 | Powerex Inc. | MOD IPM 6-PAC 30A 600V DIP | Inquiry |
 |
STIPN2M50T-H | STMicroelectronics | POWER DRVR MOD 500V 2A 26DIP MOD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers