BYCHIPS is the stocking distributor for IPD70R950CEAUMA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IPD70R950CEAUMA1 by email, we will give you a best price according your plan.
Buy IPD70R950CEAUMA1 with BYCHPS
Buy with guarantee
IPD70R950CEAUMA1
- Part Number:
- IPD70R950CEAUMA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- MOSFET N-CH 700V 7.4A TO252-3
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13952 Pieces
- Data sheet:
- IPD70R950CEAUMA1.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 3.5V @ 150µA |
|---|---|
| Vgs (Max): | ±20V |
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | PG-TO252-3 |
| Series: | CoolMOS™ |
| Rds On (Max) @ Id, Vgs: | 950 mOhm @ 1.5A, 10V |
| Power Dissipation (Max): | 68W (Tc) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Other Names: | IPD70R950CEAUMA1-ND IPD70R950CEAUMA1TR SP001466970 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | IPD70R950CEAUMA1 |
| Input Capacitance (Ciss) (Max) @ Vds: | 328pF @ 100V |
| Gate Charge (Qg) (Max) @ Vgs: | 15.3nC @ 10V |
| FET Type: | N-Channel |
| FET Feature: | Super Junction |
| Expanded Description: | N-Channel 700V 7.4A (Tc) 68W (Tc) Surface Mount PG-TO252-3 |
| Drive Voltage (Max Rds On, Min Rds On): | 10V |
| Drain to Source Voltage (Vdss): | 700V |
| Description: | MOSFET N-CH 700V 7.4A TO252-3 |
| Current - Continuous Drain (Id) @ 25°C: | 7.4A (Tc) |
| Email: | [email protected] |
Related parts for IPD70R950CEAUMA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers