BYCHIPS is the stocking distributor for IDT2309NZ-1HPGI, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IDT2309NZ-1HPGI by email, we will give you a best price according your plan.
Buy IDT2309NZ-1HPGI with BYCHPS
Buy with guarantee
IDT2309NZ-1HPGI
- Part Number:
- IDT2309NZ-1HPGI
- Manufacturer:
- IDT (Integrated Device Technology)
- Description:
- IC CLK BUF 1:9 133.33MHZ 16TSSOP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12697 Pieces
- Data sheet:
- IDT2309NZ-1HPGI.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Fanout Buffer (Distribution) |
| Supplier Device Package: | 16-TSSOP |
| Series: | - |
| Ratio - Input:Output: | 1:9 |
| Packaging: | Tube |
| Package / Case: | 16-TSSOP (0.173", 4.40mm Width) |
| Output: | LVTTL |
| Other Names: | 2309NZ-1HPGI |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IDT2309NZ-1HPGI |
| Input: | LVTTL |
| Frequency - Max: | 133.33MHz |
| Expanded Description: | Clock Fanout Buffer (Distribution) IC 133.33MHz 16-TSSOP (0.173", 4.40mm Width) |
| Differential - Input:Output: | No/No |
| Description: | IC CLK BUF 1:9 133.33MHZ 16TSSOP |
| Email: | [email protected] |
Related parts for IDT2309NZ-1HPGI
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers