BYCHIPS is the stocking distributor for IDD03SG60C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IDD03SG60C by email, we will give you a best price according your plan.
Buy IDD03SG60C with BYCHPS
Buy with guarantee
IDD03SG60C
- Part Number:
- IDD03SG60C
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- DIODE SCHOTTKY 600V 3A TO252-3
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19035 Pieces
- Data sheet:
- IDD03SG60C.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 2.3V @ 3A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | PG-TO252-3 |
| Speed: | No Recovery Time > 500mA (Io) |
| Series: | thinQ!™ |
| Reverse Recovery Time (trr): | 0ns |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Other Names: | IDD03SG60C-ND IDD03SG60CTR IDD03SG60CXTMA1 SP000411542 SP000786802 |
| Operating Temperature - Junction: | -55°C ~ 175°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | IDD03SG60C |
| Expanded Description: | Diode Silicon Carbide Schottky 600V 3A (DC) Surface Mount PG-TO252-3 |
| Diode Type: | Silicon Carbide Schottky |
| Description: | DIODE SCHOTTKY 600V 3A TO252-3 |
| Current - Reverse Leakage @ Vr: | 15µA @ 600V |
| Current - Average Rectified (Io): | 3A (DC) |
| Capacitance @ Vr, F: | 60pF @ 1V, 1MHz |
| Email: | [email protected] |
Related parts for IDD03SG60C
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers