BYCHIPS is the stocking distributor for HZA277M035G24T-F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HZA277M035G24T-F by email, we will give you a best price according your plan.
Buy HZA277M035G24T-F with BYCHPS
Buy with guarantee
HZA277M035G24T-F
- Part Number:
- HZA277M035G24T-F
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP ALUM POLY HYB 270UF 35V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16123 Pieces
- Data sheet:
- HZA277M035G24T-F.pdf
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Type: | Hybrid |
| Tolerance: | ±20% |
| Surface Mount Land Size: | 0.406" L x 0.406" W (10.30mm x 10.30mm) |
| Size / Dimension: | 0.394" Dia (10.00mm) |
| Series: | HZA |
| Ripple Current - Low Frequency: | 250mA @ 120Hz |
| Ripple Current - High Frequency: | 2.5A @ 100kHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Radial, Can - SMD |
| Other Names: | HZA227M035G24T-F HZA227M035G24T-FTR HZA227M035G24T-FTR-ND HZA277M035G24T-FTR |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | HZA277M035G24T-F |
| Lifetime @ Temp.: | 10000 Hrs @ 105°C |
| Lead Spacing: | - |
| Impedance: | - |
| Height - Seated (Max): | 0.413" (10.50mm) |
| Expanded Description: | 270µF ±20% 35V Aluminum Polymer Capacitor Radial, Can - SMD 20 mOhm 10000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 20 mOhm |
| Description: | CAP ALUM POLY HYB 270UF 35V SMD |
| Capacitance: | 270µF |
| Applications: | Bypass, Decoupling |
| Email: | [email protected] |
Related parts for HZA277M035G24T-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers