BYCHIPS is the stocking distributor for HT8822N, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HT8822N by email, we will give you a best price according your plan.
Buy HT8822N with BYCHPS
Buy with guarantee
HT8822N
- Part Number:
- HT8822N
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- IC PWR CONV TBD 8-MDIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14819 Pieces
- Data sheet:
- HT8822N.pdf
Introduction
Specifications
| Supplier Device Package: | - |
|---|---|
| Series: | * |
| Packaging: | - |
| Package / Case: | - |
| Mounting Type: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | HT8822N |
| Expanded Description: | PMIC |
| Description: | IC PWR CONV TBD 8-MDIP |
| Email: | [email protected] |
Related parts for HT8822N
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAX16913GEE+T | Maxim Integrated | IC CURRENT SENSE SWITCH 16-QSOP | Inquiry |
 |
AT73C202J | Microchip Technology | IC PWR/BATT MNGMT CELL 49-BGA | Inquiry |
 |
73S8009C-20IM/F | Maxim Integrated | IC PWR MGMT/SMART CARD INT 20QFN | Inquiry |
 |
LP3972SQX-E514 | Texas Instruments | IC PMU FOR APP PROCESSOR 40WQFN | Inquiry |
|
SN6501QDBVRQ1 | Texas Instruments | IC XFRMR DRVR NCH 350MA SOT23-5 | Inquiry |
 |
MCZ33689DEW | NXP USA Inc. | IC SYSTEM BASIS CHIP LIN 32-SOIC | Inquiry |
 |
IR3086AMTRPBF | Infineon Technologies | IC CTLR XPHASE 28-MLPQ | Inquiry |
 |
MAX17109ETJ+T | Maxim Integrated | IC SCAN DVR DUAL HV 32-TQFN | Inquiry |
 |
ISL97642IRTZ | Intersil | IC REG TFT-LCD DC/DC 32-TQFN | Inquiry |
|
LP3906SQE-PPXP/NOPB | Texas Instruments | IC REG DC-DC/LINEAR DUAL 24WQFN | Inquiry |
 |
MAX845EUA+T | Maxim Integrated | IC DRVR TRANSF ISO 8-UMAX | Inquiry |
|
TPS75003MRHLREP | Texas Instruments | IC PWR MGMT TRIPLE-SUPPLY 20-QFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers