BYCHIPS is the stocking distributor for HMB1201K01P, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HMB1201K01P by email, we will give you a best price according your plan.
Buy HMB1201K01P with BYCHPS
Buy with guarantee
HMB1201K01P
- Part Number:
- HMB1201K01P
- Manufacturer:
- Aerospace Defense and Marine / TE Connectivity
- Description:
- RELAY GEN PURPOSE DPDT 2A 26.5V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 18893 Pieces
- Data sheet:
- HMB1201K01P.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 15 VDC |
|---|---|
| Turn Off Voltage (Min): | 1.5 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 28VDC - Nom |
| Series: | Military, MIL-R-39016/22, HMB, CII |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 1122-1137 1122-1137-MIL 2-1617038-2 A101707 A101707-ND HMB1201K01P-ND M39016/22-009P |
| Operating Temperature: | -65°C ~ 125°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | HMB1201K01P |
| Features: | Sealed - Hermetically |
| Expanded Description: | General Purpose Relay DPDT (2 Form C) Through Hole |
| Description: | RELAY GEN PURPOSE DPDT 2A 26.5V |
| Contact Rating (Current): | 2A |
| Contact Material: | - |
| Contact Form: | DPDT (2 Form C) |
| Coil Voltage: | 26.5VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | - |
| Coil Power: | - |
| Coil Current: | 37.86mA |
| Email: | [email protected] |
Related parts for HMB1201K01P
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers