BYCHIPS is the stocking distributor for HLT22507Z25R00KJ, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HLT22507Z25R00KJ by email, we will give you a best price according your plan.
Buy HLT22507Z25R00KJ with BYCHPS
Buy with guarantee
HLT22507Z25R00KJ
- Part Number:
- HLT22507Z25R00KJ
- Manufacturer:
- Dale / Vishay
- Description:
- RES CHAS MNT 25 OHM 10% 225W
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 17882 Pieces
- Data sheet:
- HLT22507Z25R00KJ.pdf
Introduction
Specifications
| Tolerance: | ±10% |
|---|---|
| Temperature Coefficient: | ±30ppm/°C |
| Size / Dimension: | 1.125" Dia x 10.500" L (28.58mm x 266.70mm) |
| Series: | HLT |
| Resistance (Ohms): | 25 |
| Power (Watts): | 225W |
| Packaging: | Bulk |
| Package / Case: | Radial, Tubular |
| Other Names: | HLTA-25 |
| Operating Temperature: | -55°C ~ 350°C |
| Mounting Feature: | Brackets (not included) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | HLT22507Z25R00KJ |
| Lead Style: | Solder Lugs |
| Height - Seated (Max): | - |
| Features: | - |
| Failure Rate: | - |
| Description: | RES CHAS MNT 25 OHM 10% 225W |
| Composition: | Wirewound |
| Coating, Housing Type: | Silicon Coated |
| Email: | [email protected] |
Related parts for HLT22507Z25R00KJ
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
HLT22507Z1K000KJ | Vishay Dale | RES CHAS MNT 1K OHM 10% 225W | Inquiry |
|
HLT22507Z250R0KJ | Vishay Dale | RES CHAS MNT 250 OHM 10% 225W | Inquiry |
|
HLT22507Z500R0KJ | Vishay Dale | RES CHAS MNT 500 OHM 10% 225W | Inquiry |
|
HLT22507Z10R00KJ | Vishay Dale | RES CHAS MNT 10 OHM 10% 225W | Inquiry |
|
HLT22507Z100R0KJ | Vishay Dale | RES CHAS MNT 100 OHM 10% 225W | Inquiry |
|
HLT22507Z50R00KJ | Vishay Dale | RES CHAS MNT 50 OHM 10% 225W | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers