BYCHIPS is the stocking distributor for HGT1N30N60A4D, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HGT1N30N60A4D by email, we will give you a best price according your plan.
Buy HGT1N30N60A4D with BYCHPS
Buy with guarantee
HGT1N30N60A4D
- Part Number:
- HGT1N30N60A4D
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- IGBT SMPS N-CHAN 600V SOT-227
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15577 Pieces
- Data sheet:
- HGT1N30N60A4D.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.7V @ 15V, 30A |
| Supplier Device Package: | SOT-227 |
| Series: | - |
| Power - Max: | 255W |
| Package / Case: | SOT-227-4, miniBLOC |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | HGT1N30N60A4D |
| Input Capacitance (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | - |
| Expanded Description: | IGBT Module Single 600V 96A 255W Chassis Mount SOT-227 |
| Description: | IGBT SMPS N-CHAN 600V SOT-227 |
| Current - Collector Cutoff (Max): | 250µA |
| Current - Collector (Ic) (Max): | 96A |
| Configuration: | Single |
| Email: | [email protected] |
Related parts for HGT1N30N60A4D
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FMG1G75US60H | Fairchild/ON Semiconductor | IGBT MOLDING 600V 75A 7PM-GA | Inquiry |
|
HGT1N40N60A4D | Fairchild/ON Semiconductor | IGBT SMPS N-CHAN 600V SOT-227 | Inquiry |
 |
CM600HB-24A | Powerex Inc. | IGBT MOD SGL 1200V 600A A SER | Inquiry |
 |
VS-EMG050J60N | Vishay Semiconductor Diodes Division | IGBT 600V 88A 338W EMIPAK2 | Inquiry |
 |
APTGT30X60T3G | Microsemi Corporation | IGBT MOD TRENCH 3PH BRIDGE SP3 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers