BYCHIPS is the stocking distributor for HFB160093-200, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HFB160093-200 by email, we will give you a best price according your plan.
Buy HFB160093-200 with BYCHPS
Buy with guarantee
HFB160093-200
- Part Number:
- HFB160093-200
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 120 OHM SOLID
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17122 Pieces
- Data sheet:
- 1.HFB160093-200.pdf2.HFB160093-200.pdf
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | HF |
| Ratings: | - |
| Outer Dimension: | 0.630" Dia (16.00mm) |
| Other Names: | 240-2274 HFB160093200 |
| Mounting Type: | Free Hanging |
| Material: | HF |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | HFB160093-200 |
| Length: | 0.748" (19.00mm) |
| Inner Dimension: | 0.364" Dia (9.25mm) |
| Impedance @ Frequency: | 120 Ohm @ 300MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 120 Ohm @ 300MHz ID 0.364" Dia (9.25mm) OD 0.630" Dia (16.00mm) Length 0.748" (19.00mm) |
| Design: | Solid |
| Description: | FERRITE CORE 120 OHM SOLID |
| Email: | [email protected] |
Related parts for HFB160093-200
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CF2-4.6*1.85*6 | API Delevan Inc. | FERRITE CORE 77 OHM SOLID 1.85MM | Inquiry |
 |
HFB160093-300 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Inquiry |
 |
28R1101-000 | Laird-Signal Integrity Products | FERRITE CORE 140 OHM SOLID | Inquiry |
 |
28A3039-0A2 | Laird-Signal Integrity Products | FERRITE CORE 130 OHM HINGED | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers