BYCHIPS is the stocking distributor for HFB157070-000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HFB157070-000 by email, we will give you a best price according your plan.
Buy HFB157070-000 with BYCHPS
Buy with guarantee
HFB157070-000
- Part Number:
- HFB157070-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 170 OHM SOLID
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19572 Pieces
- Data sheet:
- 1.HFB157070-000.pdf2.HFB157070-000.pdf
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | HF |
| Ratings: | - |
| Outer Dimension: | 0.616" Dia (15.65mm) |
| Other Names: | 240-2273 HFB157070000 |
| Mounting Type: | Free Hanging |
| Material: | HF |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | HFB157070-000 |
| Length: | 0.787" (20.00mm) |
| Inner Dimension: | 0.275" Dia (6.99mm) |
| Impedance @ Frequency: | 170 Ohm @ 300MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 170 Ohm @ 300MHz ID 0.275" Dia (6.99mm) OD 0.616" Dia (15.65mm) Length 0.787" (20.00mm) |
| Design: | Solid |
| Description: | FERRITE CORE 170 OHM SOLID |
| Email: | [email protected] |
Related parts for HFB157070-000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
28B1417-200 | Laird-Signal Integrity Products | FERRITE CORE 115 OHM SOLID 23MM | Inquiry |
 |
HFB159079-100 | Laird-Signal Integrity Products | FERRITE CORE 235 OHM SOLID | Inquiry |
 |
28R0453-300 | Laird-Signal Integrity Products | FERRITE CORE 160 OHM SOLID | Inquiry |
 |
HFB150070-200 | Laird-Signal Integrity Products | FERRITE CORE 242 OHM SOLID | Inquiry |
 |
HFB152034-000 | Laird-Signal Integrity Products | FERRITE CORE 165 OHM SOLID | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers