BYCHIPS is the stocking distributor for HFB143064-000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HFB143064-000 by email, we will give you a best price according your plan.
Buy HFB143064-000 with BYCHPS
Buy with guarantee
HFB143064-000
- Part Number:
- HFB143064-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 43 OHM SOLID 6.35MM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12076 Pieces
- Data sheet:
- 1.HFB143064-000.pdf2.HFB143064-000.pdf
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | HF |
| Ratings: | - |
| Outer Dimension: | 0.562" Dia (14.27mm) |
| Other Names: | 240-2271 |
| Mounting Type: | Free Hanging |
| Material: | HF |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | HFB143064-000 |
| Length: | 0.197" (5.00mm) |
| Inner Dimension: | 0.250" Dia (6.35mm) |
| Impedance @ Frequency: | 43 Ohm @ 300MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 43 Ohm @ 300MHz ID 0.250" Dia (6.35mm) OD 0.562" Dia (14.27mm) Length 0.197" (5.00mm) |
| Design: | Solid |
| Description: | FERRITE CORE 43 OHM SOLID 6.35MM |
| Email: | [email protected] |
Related parts for HFB143064-000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
HFB143064-200 | Laird-Signal Integrity Products | FERRITE CORE HINGED | Inquiry |
 |
HFB143064-100 | Laird-Signal Integrity Products | FERRITE CORE 85 OHM SOLID 6.35MM | Inquiry |
 |
28B0735-300 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Inquiry |
 |
AB 4X2X6 W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Inquiry |
 |
HFB143064-300 | Laird-Signal Integrity Products | FERRITE CORE 270 OHM SOLID | Inquiry |
 |
ZCAT10D-BK | TDK Corporation | FERRITE CORE 70 OHM HINGED | Inquiry |
 |
28A0392-0A2 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM HINGED | Inquiry |
 |
ESD-R-19 | KEMET | FERRITE CORE SOLID 9MM | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers