BYCHIPS is the stocking distributor for HFA15TB60-1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HFA15TB60-1 by email, we will give you a best price according your plan.
Buy HFA15TB60-1 with BYCHPS
Buy with guarantee
HFA15TB60-1
- Part Number:
- HFA15TB60-1
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Description:
- DIODE GEN PURP 600V 15A TO262
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12376 Pieces
- Data sheet:
- HFA15TB60-1.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.7V @ 15A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | TO-262 |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | HEXFRED® |
| Reverse Recovery Time (trr): | 60ns |
| Packaging: | Tube |
| Package / Case: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| Other Names: | *HFA15TB60-1 HFA15TB601 |
| Operating Temperature - Junction: | -55°C ~ 150°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | HFA15TB60-1 |
| Expanded Description: | Diode Standard 600V 15A (DC) Through Hole TO-262 |
| Diode Type: | Standard |
| Description: | DIODE GEN PURP 600V 15A TO262 |
| Current - Reverse Leakage @ Vr: | 10µA @ 600V |
| Current - Average Rectified (Io): | 15A (DC) |
| Capacitance @ Vr, F: | - |
| Email: | [email protected] |
Related parts for HFA15TB60-1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers