BYCHIPS is the stocking distributor for GZA30000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GZA30000 by email, we will give you a best price according your plan.
Buy GZA30000 with BYCHPS
Buy with guarantee
GZA30000
- Part Number:
- GZA30000
- Manufacturer:
- Sprague Goodman
- Description:
- CAP TRIM 2.5-30PF 100V THRU HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12657 Pieces
- Data sheet:
- GZA30000.pdf
Introduction
Specifications
| Voltage - Rated: | 100V |
|---|---|
| Size / Dimension: | 0.335" L x 0.295" W (8.50mm x 7.50mm) |
| Series: | - |
| Packaging: | Bulk |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GZA30000 |
| Height - Seated (Max): | 0.402" (10.20mm) |
| Features: | General Purpose |
| Expanded Description: | 2.5 ~ 30pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Description: | CAP TRIM 2.5-30PF 100V THRU HOLE |
| Capacitance Range: | 2.5 ~ 30pF |
| Adjustment Type: | Top and Bottom Adjustment |
| Email: | [email protected] |
Related parts for GZA30000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
GZL32000 | Sprague-Goodman | CAP TRIM 3.6-32PF 150V THRU HOLE | Inquiry |
|
GZA30002 | Sprague-Goodman | CAP TRIM 2.5-30PF 100V THRU HOLE | Inquiry |
|
GYC65004 | Sprague-Goodman | CAP TRIMMER 4.5-65PF 100V TH | Inquiry |
 |
GKY30046 | Sprague-Goodman | CAP TRIMMER 5.5-30PF 50V SMD | Inquiry |
 |
SGNMNC3103 | Sprague-Goodman | CAP TRIM 1.5-10PF 3KV CHASS MNT | Inquiry |
|
GEP60000 | Sprague-Goodman | CAP TRIM 1-60PF 750V PNL MOUNT | Inquiry |
 |
GKG3R067-07 | Sprague-Goodman | CAP TRIMMER 1.7-3PF 100V SMD | Inquiry |
|
GNL4R500 | Sprague-Goodman | CAP TRIM 0.6-4.5PF 500V SURF MNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers