BYCHIPS is the stocking distributor for GSG006, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GSG006 by email, we will give you a best price according your plan.
Buy GSG006 with BYCHPS
Buy with guarantee
GSG006
- Part Number:
- GSG006
- Manufacturer:
- Sprague Goodman
- Description:
- CAP TRIM 1.2-10PF 500V PNL MOUNT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12205 Pieces
- Data sheet:
- GSG006.pdf
Introduction
Specifications
| Voltage - Rated: | 500V |
|---|---|
| Size / Dimension: | 0.312" Dia x 0.266" L (7.92mm x 6.76mm) |
| Series: | - |
| Packaging: | Bulk |
| Mounting Type: | Panel Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GSG006 |
| Height - Seated (Max): | - |
| Features: | General Purpose |
| Expanded Description: | 1.2 ~ 10pF Trimmer Capacitor 500V Panel Mount |
| Description: | CAP TRIM 1.2-10PF 500V PNL MOUNT |
| Capacitance Range: | 1.2 ~ 10pF |
| Adjustment Type: | - |
| Email: | [email protected] |
Related parts for GSG006
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
GKU30020 | Sprague-Goodman | CAP TRIM 7-30PF 200V THRU HOLE | Inquiry |
 |
TZV2Z100A110R00 | Murata Electronics North America | CAP TRIMMER 3-10PF 25V SMD | Inquiry |
|
GEN42000 | Sprague-Goodman | CAP TRIM 1-42PF 750V THRU HOLE | Inquiry |
|
SGNMNC2206K | Sprague-Goodman | CAP TRIM 2-20PF 6KV CHASS MNT | Inquiry |
|
GSG009 | Sprague-Goodman | CAP TRIM 1.2-16PF 500V THRU HOLE | Inquiry |
|
GWR2R500 | Sprague-Goodman | CAP TRIM 0.4-2.5PF 500V | Inquiry |
|
GSG007 | Sprague-Goodman | CAP TRIM 1.2-16PF 500V PNL MOUNT | Inquiry |
|
GMC20700 | Sprague-Goodman | CAP TRIM 55-285PF 175V THRU HOLE | Inquiry |
 |
CTZ3S-05A-W5 | AVX Corporation | CAP TRIMMER 1.5-5PF 25V SMD | Inquiry |
|
GQL9R500 | Sprague-Goodman | CAP TRIMMER SMD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers