BYCHIPS is the stocking distributor for GRM31M6T1H392JD01L, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GRM31M6T1H392JD01L by email, we will give you a best price according your plan.
Buy GRM31M6T1H392JD01L with BYCHPS
Buy with guarantee
GRM31M6T1H392JD01L
- Part Number:
- GRM31M6T1H392JD01L
- Manufacturer:
- Murata Electronics
- Description:
- CAP CER 3900PF 50V T2H 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16983 Pieces
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±5% |
| Thickness (Max): | 0.049" (1.25mm) |
| Temperature Coefficient: | T2H |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | GRM |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric) |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GRM31M6T1H392JD01L |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | - |
| Expanded Description: | 3900pF ±5% 50V Ceramic Capacitor T2H 1206 (3216 Metric) |
| Description: | CAP CER 3900PF 50V T2H 1206 |
| Capacitance: | 3900pF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for GRM31M6T1H392JD01L
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers