BYCHIPS is the stocking distributor for GN7053-CHIP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GN7053-CHIP by email, we will give you a best price according your plan.
Buy GN7053-CHIP with BYCHPS
Buy with guarantee
GN7053-CHIP
- Part Number:
- GN7053-CHIP
- Manufacturer:
- Semtech
- Description:
- IC AMP TIA 1.25G GPON DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19247 Pieces
- Data sheet:
- GN7053-CHIP.pdf
Introduction
Specifications
| Type: | Transimpedance Amplifier |
|---|---|
| Supplier Device Package: | - |
| Series: | - |
| Packaging: | - |
| Package / Case: | - |
| Mounting Type: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GN7053-CHIP |
| Expanded Description: | Transimpedance Amplifier IC Audio |
| Description: | IC AMP TIA 1.25G GPON DIE |
| Applications: | Audio |
| Email: | [email protected] |
Related parts for GN7053-CHIP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAX9003EUA | Maxim Integrated | IC OP AMP LP HI SPEED 8-UMAX | Inquiry |
 |
NT24L73-MSOP-TR | Semtech Corporation | IC AMP LIMITING 1.25GBPS 10MSOP | Inquiry |
 |
MAX3861EGG | Maxim Integrated | IC POST AMP 2.7GBPS W/AGC 24TQFN | Inquiry |
 |
ADPD2210ACPZ-RL | Analog Devices Inc. | IC AMP LP ULTRA-LOW NOISE 6LFCSP | Inquiry |
 |
MAX952ESA-T | Maxim Integrated | IC OP AMP/COMP/REF SS LP 8-SOIC | Inquiry |
 |
GN7052-CHIP | Semtech Corporation | IC AMP TIA MULTI TRI-RATE DIE | Inquiry |
 |
MAX3746HETE#TG16 | Maxim Integrated | IC LIMITING AMP SFF/SFP 16TQFN | Inquiry |
 |
SY88973VMI | Microchip Technology | IC AMP LIMIT CML TTL LOS 16MLF | Inquiry |
 |
MAX2038CCQ+D | Maxim Integrated | IC AMP VGA MIXER 100TQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers