BYCHIPS is the stocking distributor for GN1052CW-CHIP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GN1052CW-CHIP by email, we will give you a best price according your plan.
Buy GN1052CW-CHIP with BYCHPS
Buy with guarantee
GN1052CW-CHIP
- Part Number:
- GN1052CW-CHIP
- Manufacturer:
- Semtech
- Description:
- IC TRANSIMPEDANCE AMP DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18797 Pieces
- Data sheet:
- GN1052CW-CHIP.pdf
Introduction
Specifications
| Type: | Transimpedance Amplifier |
|---|---|
| Supplier Device Package: | Die |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | Die |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GN1052CW-CHIP |
| Expanded Description: | Transimpedance Amplifier IC Ethernet Die |
| Description: | IC TRANSIMPEDANCE AMP DIE |
| Applications: | Ethernet |
| Email: | [email protected] |
Related parts for GN1052CW-CHIP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
GN1052CWA2-CHIP | Semtech Corporation | IC TRANSIMPEDANCE AMP MODULE | Inquiry |
|
GN1056CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10G LIN OC-192 | Inquiry |
 |
MAX951EPA | Maxim Integrated | IC OP AMP/COMP/REF SS LP 8-DIP | Inquiry |
|
GN1052WA2-CHIP | Semtech Corporation | IC TRANSIMPEDANCE AMP MODULE | Inquiry |
|
GN1055CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10/11.3GBPS | Inquiry |
|
GN1057CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V AGC 10/11.3GBPS | Inquiry |
|
GN1058CW-CHIP | Semtech Corporation | IC AMP TIA 10G LIN AGC REV PIN | Inquiry |
 |
LTC6360HDD#PBF | Linear Technology | IC ADC DRIVER TRUE ZERO 8DFN | Inquiry |
 |
AD8305ACPZ-RL7 | Analog Devices Inc. | IC LOGARITH CONV 100DB 16-LFCSP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog