BYCHIPS is the stocking distributor for GMD41000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GMD41000 by email, we will give you a best price according your plan.
Buy GMD41000 with BYCHPS
Buy with guarantee
GMD41000
- Part Number:
- GMD41000
- Manufacturer:
- Sprague Goodman
- Description:
- CAP TRIM 260-900PF 175V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16571 Pieces
- Data sheet:
- GMD41000.pdf
Introduction
Specifications
| Voltage - Rated: | 175V |
|---|---|
| Size / Dimension: | 0.531" L x 0.375" W (13.50mm x 9.53mm) |
| Series: | GMD |
| Packaging: | Bulk |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GMD41000 |
| Height - Seated (Max): | 0.720" (18.30mm) |
| Features: | General Purpose |
| Expanded Description: | 260 ~ 900pF Trimmer Capacitor 175V Side Adjustment Through Hole |
| Description: | CAP TRIM 260-900PF 175V T/H |
| Capacitance Range: | 260 ~ 900pF |
| Adjustment Type: | Side Adjustment |
| Email: | [email protected] |
Related parts for GMD41000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
GMD41400 | Sprague-Goodman | CAP TRIM 380-1300PF 175V T/H | Inquiry |
|
GMD41300 | Sprague-Goodman | CAP TRIM 360-1200PF 175V T/H | Inquiry |
|
GXT60000 | Sprague-Goodman | CAP TRIM 5.5-60PF 200V THRU HOLE | Inquiry |
|
GMD41500 | Sprague-Goodman | CAP TRIM 420-1400PF 175V T/H | Inquiry |
|
GMD41200 | Sprague-Goodman | CAP TRIM 330-1100PF 175V T/H | Inquiry |
|
GXL3R000 | Sprague-Goodman | CAP TRIM THRU HOLE | Inquiry |
|
GMD41100 | Sprague-Goodman | CAP TRIM 300-1000PF 175V T/H | Inquiry |
 |
GCL40000 | Sprague-Goodman | CAP TRIMMER 1-40PF 50V TH | Inquiry |
 |
0538-074-F-15.0-60LF | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Inquiry |
|
GHC23000 | Sprague-Goodman | CAP TRIMMER TH | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers