BYCHIPS is the stocking distributor for GFV36000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for GFV36000 by email, we will give you a best price according your plan.
Buy GFV36000 with BYCHPS
Buy with guarantee
GFV36000
- Part Number:
- GFV36000
- Manufacturer:
- Sprague Goodman
- Description:
- CAP TRIM 1-36PF 1KV THRU HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17097 Pieces
- Data sheet:
- GFV36000.pdf
Introduction
Specifications
| Voltage - Rated: | 1000V (1kV) |
|---|---|
| Size / Dimension: | 0.312" Dia x 0.734" L (7.92mm x 18.64mm) |
| Series: | - |
| Packaging: | Bulk |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | GFV36000 |
| Height - Seated (Max): | - |
| Features: | General Purpose |
| Expanded Description: | 1 ~ 36pF Trimmer Capacitor 1000V (1kV) Side Adjustment Through Hole |
| Description: | CAP TRIM 1-36PF 1KV THRU HOLE |
| Capacitance Range: | 1 ~ 36pF |
| Adjustment Type: | Side Adjustment |
| Email: | [email protected] |
Related parts for GFV36000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
GFV36031 | Sprague-Goodman | CAP TRIM 1-36PF 1KV SURF MOUNT | Inquiry |
|
JFD-DC419Y | Sprague-Goodman | CAP TRIM 2-26, 6-28PF 500V PNL M | Inquiry |
|
GFV36033 | Sprague-Goodman | CAP TRIM 1-36PF 1KV SURF MOUNT | Inquiry |
|
GHV11031 | Sprague-Goodman | CAP TRIM 0.8-11PF 1.25KV SMD | Inquiry |
|
GXC15103 | Sprague-Goodman | CAP TRIM 10-150PF 100V THRU HOLE | Inquiry |
 |
SGNMNC1106K | Sprague-Goodman | CAP TRIM 1-10PF 6KV CHASS MNT | Inquiry |
 |
SGNMNC3706 | Sprague-Goodman | CAP TRIM 2-70PF 6KV CHASS MNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers