BYCHIPS is the stocking distributor for G4B-112T1-FD-C-US-RPAC12, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for G4B-112T1-FD-C-US-RPAC12 by email, we will give you a best price according your plan.
Buy G4B-112T1-FD-C-US-RPAC12 with BYCHPS
Buy with guarantee
G4B-112T1-FD-C-US-RPAC12
- Part Number:
- G4B-112T1-FD-C-US-RPAC12
- Manufacturer:
- Omron
- Description:
- RELAY GEN PURPOSE SPDT 25A 12V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15696 Pieces
- Data sheet:
- G4B-112T1-FD-C-US-RPAC12.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 9.6 VAC |
|---|---|
| Turn Off Voltage (Min): | 3.6 VAC |
| Termination Style: | Quick Connect - 0.187"/0.250" |
| Switching Voltage: | 250VAC, 125VDC - Max |
| Series: | G4B |
| Release Time: | 20ms |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | G4B112T1FDCUSRPAC12 |
| Operating Temperature: | -10°C ~ 55°C |
| Operate Time: | 20ms |
| Mounting Type: | Chassis Mount |
| Manufacturer Part Number: | G4B-112T1-FD-C-US-RPAC12 |
| Features: | - |
| Expanded Description: | General Purpose Relay SPDT (1 Form C) 12VAC Coil Chassis Mount |
| Description: | RELAY GEN PURPOSE SPDT 25A 12V |
| Contact Rating (Current): | 25A |
| Contact Material: | Silver Indium Tin (AgInSn) |
| Contact Form: | SPDT (1 Form C) |
| Coil Voltage: | 12VAC |
| Coil Type: | Non Latching |
| Coil Resistance: | - |
| Coil Power: | 1.3 VA |
| Coil Current: | 108mA |
| Email: | [email protected] |
Related parts for G4B-112T1-FD-C-US-RPAC12
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers