BYCHIPS is the stocking distributor for G3VM-61HR1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for G3VM-61HR1 by email, we will give you a best price according your plan.
Buy G3VM-61HR1 with BYCHPS
Buy with guarantee
G3VM-61HR1
- Part Number:
- G3VM-61HR1
- Manufacturer:
- Omron
- Description:
- RELAY MOSFET SPST 3.3A 60V 6-SOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15141 Pieces
- Data sheet:
- G3VM-61HR1.pdf
Introduction
Specifications
| Voltage - Load: | 0 ~ 60 V |
|---|---|
| Voltage - Input: | 1.33VDC |
| Termination Style: | Gull Wing |
| Supplier Device Package: | 6-SOP |
| Series: | G3VM |
| Relay Type: | Relay |
| Packaging: | Tube |
| Package / Case: | 6-SOP (0.173", 4.40mm) |
| Output Type: | AC, DC |
| Other Names: | G3VM61HR1 |
| On-State Resistance (Max): | 60 mOhm |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | G3VM-61HR1 |
| Load Current: | 3.3A |
| Expanded Description: | Solid State Relay SPST-NO (1 Form A) 6-SOP (0.173", 4.40mm) |
| Description: | RELAY MOSFET SPST 3.3A 60V 6-SOP |
| Circuit: | SPST-NO (1 Form A) |
| Email: | [email protected] |
Related parts for G3VM-61HR1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers