BYCHIPS is the stocking distributor for G26093333302JLA000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for G26093333302JLA000 by email, we will give you a best price according your plan.
Buy G26093333302JLA000 with BYCHPS
Buy with guarantee
G26093333302JLA000
- Part Number:
- G26093333302JLA000
- Manufacturer:
- Angstrohm / Vishay
- Description:
- RES 33K OHM 5% WW
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17341 Pieces
- Data sheet:
- G26093333302JLA000.pdf
Introduction
Specifications
| Tolerance: | ±5% |
|---|---|
| Temperature Coefficient: | 100/ +180ppm/°C |
| Supplier Device Package: | Axial |
| Size / Dimension: | 0.386" Dia x 1.272" L (9.80mm x 32.30mm) |
| Series: | G200 |
| Resistance (Ohms): | 33k |
| Power (Watts): | 13W |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Other Names: | BC2984 |
| Operating Temperature: | -55°C ~ 350°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | G26093333302JLA000 |
| Height - Seated (Max): | - |
| Features: | Flame Proof, Pulse Withstanding, Safety |
| Failure Rate: | - |
| Expanded Description: | 33k Ohm ±5% 13W Through Hole Resistor Axial Flame Proof, Pulse Withstanding, Safety Wirewound |
| Description: | RES 33K OHM 5% WW |
| Composition: | Wirewound |
| Email: | [email protected] |
Related parts for G26093333302JLA000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
G26093332209JLA000 | Vishay BC Components | RES 22 OHM 5% WW | Inquiry |
|
G26093333309JLA000 | Vishay BC Components | RES 33 OHM 5% WW | Inquiry |
|
G26093331509JLA000 | Vishay BC Components | RES 15 OHM 5% WW | Inquiry |
|
G26093336802JLA000 | Vishay BC Components | RES 68K OHM 5% WW | Inquiry |
|
G26093331000JLA000 | Vishay BC Components | RES 100 OHM 5% WW | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers