BYCHIPS is the stocking distributor for FYP1004DNTU, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FYP1004DNTU by email, we will give you a best price according your plan.
Buy FYP1004DNTU with BYCHPS
Buy with guarantee
FYP1004DNTU
- Part Number:
- FYP1004DNTU
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- DIODE ARRAY SCHOTTKY 40V TO220
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13842 Pieces
- Data sheet:
- 1.FYP1004DNTU.pdf2.FYP1004DNTU.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 670mV @ 10A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 40V |
| Supplier Device Package: | TO-220-3 |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | TO-220-3 |
| Operating Temperature - Junction: | -65°C ~ 150°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | FYP1004DNTU |
| Expanded Description: | Diode Array 1 Pair Common Cathode Schottky 40V 10A Through Hole TO-220-3 |
| Diode Type: | Schottky |
| Diode Configuration: | 1 Pair Common Cathode |
| Description: | DIODE ARRAY SCHOTTKY 40V TO220 |
| Current - Reverse Leakage @ Vr: | 1mA @ 40V |
| Current - Average Rectified (Io) (per Diode): | 10A |
| Email: | [email protected] |
Related parts for FYP1004DNTU
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers