BYCHIPS is the stocking distributor for FSB70250, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FSB70250 by email, we will give you a best price according your plan.
Buy FSB70250 with BYCHPS
Buy with guarantee
FSB70250
- Part Number:
- FSB70250
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- MODULE SPM 500V 3A 27-QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15242 Pieces
- Data sheet:
- FSB70250.pdf
Introduction
Specifications
| Voltage - Isolation: | 1500Vrms |
|---|---|
| Voltage: | 500V |
| Type: | MOSFET |
| Series: | Motion-SPM® |
| Package / Case: | 27-PowerLQFN Module |
| Other Names: | FSB70250CT |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 25 Weeks |
| Manufacturer Part Number: | FSB70250 |
| Expanded Description: | Power Driver Module MOSFET 3 Phase 500V 3.3A 27-PowerLQFN Module |
| Description: | MODULE SPM 500V 3A 27-QFN |
| Current: | 3.3A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for FSB70250
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FSB70625 | Fairchild/ON Semiconductor | MODULE SPM 250V 6.9A 27-QFN | Inquiry |
 |
FSB70325 | Fairchild/ON Semiconductor | MODULE SPM 250V 4.1A 27-QFN | Inquiry |
 |
PS12018-A | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 25A | Inquiry |
 |
FSB70550 | Fairchild/ON Semiconductor | MODULE SPM 500V 5.3A PQFN | Inquiry |
 |
FSB70450 | Fairchild/ON Semiconductor | MODULE SPM 500V 4.8A PQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers