BYCHIPS is the stocking distributor for FS200R07A1E3BOSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FS200R07A1E3BOSA1 by email, we will give you a best price according your plan.
Buy FS200R07A1E3BOSA1 with BYCHPS
Buy with guarantee
FS200R07A1E3BOSA1
- Part Number:
- FS200R07A1E3BOSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IGBT 650V 250A 790W
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15489 Pieces
- Data sheet:
- FS200R07A1E3BOSA1.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 650V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 1.9V @ 15V, 200A |
| Supplier Device Package: | Module |
| Series: | - |
| Power - Max: | 790W |
| Package / Case: | Module |
| Other Names: | FS200R07A1E3 FS200R07A1E3-ND FS200R07A1E3HOSA1 SP000663442 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | Yes |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | FS200R07A1E3BOSA1 |
| Input Capacitance (Cies) @ Vce: | 13nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Expanded Description: | IGBT Module Three Phase Inverter 650V 250A 790W Chassis Mount Module |
| Description: | IGBT 650V 250A 790W |
| Current - Collector Cutoff (Max): | 1mA |
| Current - Collector (Ic) (Max): | 250A |
| Configuration: | Three Phase Inverter |
| Email: | [email protected] |
Related parts for FS200R07A1E3BOSA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FS200R12A1T4H5BOMA1 | Infineon Technologies | IGBT MODULES | Inquiry |
|
FS200R07A5E3S6BPSA1 | Infineon Technologies | HYBRID PACK LIGHT | Inquiry |
 |
MG12300D-BA1MM | Littelfuse Inc. | IGBT 1200V 450A 1800W PKG D | Inquiry |
 |
VS-GB75YF120N | Vishay Semiconductor Diodes Division | IGBT 1200V 100A 480W ECONO | Inquiry |
 |
APTGT100H60T3G | Microsemi Corporation | IGBT FULL BRIDGE 600V 150A SP3 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers