BYCHIPS is the stocking distributor for FNA41060, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FNA41060 by email, we will give you a best price according your plan.
Buy FNA41060 with BYCHPS
Buy with guarantee
FNA41060
- Part Number:
- FNA41060
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- MOD SPM 600V 10A SPM26-AA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16791 Pieces
- Data sheet:
- FNA41060.pdf
Introduction
Specifications
| Voltage - Isolation: | 2000Vrms |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | Motion-SPM® |
| Package / Case: | 26-PowerDIP Module (1.024", 26.00mm) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 41 Weeks |
| Manufacturer Part Number: | FNA41060 |
| Expanded Description: | Power Driver Module IGBT 3 Phase 600V 10A 26-PowerDIP Module (1.024", 26.00mm) |
| Description: | MOD SPM 600V 10A SPM26-AA |
| Current: | 10A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for FNA41060
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FNA41060B2 | Fairchild/ON Semiconductor | MODULE SPM 600V 10A SPMAA | Inquiry |
 |
PM15CZF120 | Powerex Inc. | MOD IPM 6PAC 1200V 15A | Inquiry |
 |
IRAM136-1060A | Infineon Technologies | IC MOD PWR HYBRID 600V 10A MOTOR | Inquiry |
 |
PS11033 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 8A | Inquiry |
 |
IRAM136-1061A2 | Infineon Technologies | IC MOSFET DRIVER | Inquiry |
 |
FNA41560 | Fairchild/ON Semiconductor | MOD SPM 600V 15A SPM26-AA | Inquiry |
|
PM25CL1A120 | Powerex Inc. | MOD IPM 6-PAC L1 25A 1200V | Inquiry |
 |
FNA41560B2 | Fairchild/ON Semiconductor | MODULE SPM 600V 15A SPMAA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers