BYCHIPS is the stocking distributor for FIN324CMLX, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FIN324CMLX by email, we will give you a best price according your plan.
Buy FIN324CMLX with BYCHPS
Buy with guarantee
FIN324CMLX
- Part Number:
- FIN324CMLX
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- IC SER DES 24BIT ULP 40-MLP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15029 Pieces
- Data sheet:
- FIN324CMLX.pdf
Introduction
Specifications
| Voltage - Supply: | 1.6 V ~ 3 V |
|---|---|
| Supplier Device Package: | 40-MLP (6x6) |
| Series: | µSerDes™ |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 40-WFQFN Exposed Pad |
| Output Type: | LVCMOS |
| Other Names: | FIN324CMLX-ND FIN324CMLXTR |
| Operating Temperature: | -30°C ~ 85°C (TA) |
| Number of Outputs: | 4/24 |
| Number of Inputs: | 24/2 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | FIN324CMLX |
| Input Type: | LVCMOS |
| Function: | Serializer/Deserializer |
| Expanded Description: | Serializer/Deserializer 24/2 Input 4/24 Output 40-MLP (6x6) |
| Description: | IC SER DES 24BIT ULP 40-MLP |
| Data Rate: | - |
| Email: | [email protected] |
Related parts for FIN324CMLX
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SCAN921224SLC/NOPB | Texas Instruments | IC DESERIALIZER 10BIT 49FBGA | Inquiry |
 |
THC63LVD823B-B | CEL | IC SERIALIZER DUAL LVDS 100TQFP | Inquiry |
 |
MAX9246EUM/V+T | Maxim Integrated | IC DESERIALIZER 21BIT 48TSSOP | Inquiry |
 |
FIN324CGFX | Fairchild/ON Semiconductor | IC SER DES 24BIT ULP 42-BGA | Inquiry |
 |
THCV233-B | CEL | IC SERIALIZER SINGLE 48QFN | Inquiry |
|
MAX9288GTM/V+GG7 | Maxim Integrated | IC DESERIALIZER GMSL 3.12GBPS | Inquiry |
|
SN65LVDS93AIDGGRQ1 | Texas Instruments | IC XMITTER LVDS SERDES 56TSSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers