BYCHIPS is the stocking distributor for FG0H475ZF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FG0H475ZF by email, we will give you a best price according your plan.
Buy FG0H475ZF with BYCHPS
Buy with guarantee
FG0H475ZF
- Part Number:
- FG0H475ZF
- Manufacturer:
- KEMET
- Description:
- CAPACITOR 4.7F 5.5V RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19210 Pieces
- Data sheet:
- FG0H475ZF.pdf
Introduction
Specifications
| Voltage - Rated: | 5.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | PC Pins |
| Size / Dimension: | 1.122" Dia (28.50mm) |
| Series: | FG |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 399-13108 USCFG00H475Z00 |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | FG0H475ZF |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.400" (10.16mm) |
| Height - Seated (Max): | 0.866" (22.00mm) |
| Expanded Description: | 4.7F -20%, +80%(EDLC) Supercapacitor 5.5V Radial, Can 35 Ohm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 35 Ohm |
| Description: | CAPACITOR 4.7F 5.5V RADIAL |
| Capacitance: | 4.7F |
| Email: | [email protected] |
Related parts for FG0H475ZF
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FG0H473ZF | KEMET | CAPACITOR 47MF 5.5V RADIAL | Inquiry |
 |
FG0H474ZF | KEMET | CAP 470MF -20% +80% 5.5V T/H | Inquiry |
 |
DZN-2R7D105G5T | Elna America | CAP 1F -20% +80% 2.7V T/H | Inquiry |
 |
155DCN5R5M | Illinois Capacitor | CAP 1.5F 20% 5.5V T/H | Inquiry |
 |
EEC-RF0H104 | Panasonic Electronic Components | CAP 100MF -20% +80% 5.5V T/H | Inquiry |
 |
CDHC301K2R3SR | Cornell Dubilier Electronics (CDE) | CAP 300F -5% +10% 2.3V T/H | Inquiry |
 |
DVS-3R6D104T-R5 | Elna America | CAP 100MF 3.6V SURFACE MOUNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers