BYCHIPS is the stocking distributor for FG0H225ZF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FG0H225ZF by email, we will give you a best price according your plan.
Buy FG0H225ZF with BYCHPS
Buy with guarantee
FG0H225ZF
- Part Number:
- FG0H225ZF
- Manufacturer:
- KEMET
- Description:
- CAP 2.2F -20% +80% 5.5V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 20153 Pieces
- Data sheet:
- FG0H225ZF.pdf
Introduction
Specifications
| Voltage - Rated: | 5.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Through Hole |
| Size / Dimension: | 0.846" Dia (21.50mm) |
| Series: | FG |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 399-10814 |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | FG0H225ZF |
| Lifetime @ Temp.: | - |
| Lead Spacing: | 0.300" (7.62mm) |
| Height - Seated (Max): | 0.748" (19.00mm) |
| Expanded Description: | 2.2F -20%, +80%(EDLC) Supercapacitor 5.5V Radial, Can 35 Ohm @ 1kHz |
| ESR (Equivalent Series Resistance): | 35 Ohm @ 1kHz |
| Description: | CAP 2.2F -20% +80% 5.5V T/H |
| Capacitance: | 2.2F |
| Email: | [email protected] |
Related parts for FG0H225ZF
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DZN-2R5D704G4T | Elna America | CAP 700MF -20% +80% 2.5V T/H | Inquiry |
 |
MAL219622104E3 | Vishay BC Components | CAP 100MF -20%, +80% 5.5V T/H | Inquiry |
|
MAL219691211E3 | Vishay BC Components | CAP ALUM 15F 1.4V SNAP | Inquiry |
|
MAL219622474E3 | Vishay BC Components | CAP 470MF -20%, +80% 5.5V T/H | Inquiry |
 |
EDLNF104A5R5C | Cornell Dubilier Electronics (CDE) | CAP 100MF 5.5V THROUGH HOLE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers