BYCHIPS is the stocking distributor for FDB3632_F085, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FDB3632_F085 by email, we will give you a best price according your plan.
Buy FDB3632_F085 with BYCHPS
Buy with guarantee
FDB3632_F085
- Part Number:
- FDB3632_F085
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- MOSFET N-CH 100V 12A D2PAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16989 Pieces
- Data sheet:
- FDB3632_F085.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 4V @ 250µA |
|---|---|
| Vgs (Max): | ±20V |
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | D²PAK (TO-263AB) |
| Series: | Automotive, AEC-Q101, PowerTrench® |
| Rds On (Max) @ Id, Vgs: | 9 mOhm @ 80A, 10V |
| Power Dissipation (Max): | 310W (Tc) |
| Packaging: | Original-Reel® |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Other Names: | FDB3632_F085DKR |
| Operating Temperature: | -55°C ~ 175°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | FDB3632_F085 |
| Input Capacitance (Ciss) (Max) @ Vds: | 6000pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 110nC @ 10V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Expanded Description: | N-Channel 100V 12A (Ta) 310W (Tc) Surface Mount D²PAK (TO-263AB) |
| Drive Voltage (Max Rds On, Min Rds On): | 10V |
| Drain to Source Voltage (Vdss): | 100V |
| Description: | MOSFET N-CH 100V 12A D2PAK |
| Current - Continuous Drain (Id) @ 25°C: | 12A (Ta) |
| Email: | [email protected] |
Related parts for FDB3632_F085
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers