BYCHIPS is the stocking distributor for FCN1206A392J-H3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FCN1206A392J-H3 by email, we will give you a best price according your plan.
Buy FCN1206A392J-H3 with BYCHPS
Buy with guarantee
FCN1206A392J-H3
- Part Number:
- FCN1206A392J-H3
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP FILM 3900PF 5% 100VDC 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12864 Pieces
- Data sheet:
- FCN1206A392J-H3.pdf
Introduction
Specifications
| Voltage Rating - DC: | 100V |
|---|---|
| Voltage Rating - AC: | 63V |
| Tolerance: | ±5% |
| Termination: | Solder Pads |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | FCN |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric) |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | FCN1206A392J-H3 |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.067" (1.70mm) |
| Features: | - |
| Expanded Description: | 3900pF ±5% Film Capacitor 63V 100V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 1206 (3216 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Description: | CAP FILM 3900PF 5% 100VDC 1206 |
| Capacitance: | 3900pF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for FCN1206A392J-H3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers