BYCHIPS is the stocking distributor for FC0H105ZFTBR44-SS, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FC0H105ZFTBR44-SS by email, we will give you a best price according your plan.
Buy FC0H105ZFTBR44-SS with BYCHPS
Buy with guarantee
FC0H105ZFTBR44-SS
- Part Number:
- FC0H105ZFTBR44-SS
- Manufacturer:
- KEMET
- Description:
- CAP SUPER 1F 5.5 VDC SMD V-CHIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19172 Pieces
- Data sheet:
- FC0H105ZFTBR44-SS.pdf
Introduction
Specifications
| Voltage - Rated: | 5.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | - |
| Size / Dimension: | 0.827" Dia (21.00mm) |
| Series: | FC |
| Packaging: | Original-Reel® |
| Package / Case: | Radial, Can - SMD |
| Other Names: | 399-13097-6 |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | FC0H105ZFTBR44-SS |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.413" (10.50mm) |
| Expanded Description: | 1F -20%, +80%(EDLC) Supercapacitor 5.5V Radial, Can - SMD 7 Ohm |
| ESR (Equivalent Series Resistance): | 7 Ohm |
| Description: | CAP SUPER 1F 5.5 VDC SMD V-CHIP |
| Capacitance: | 1F |
| Email: | [email protected] |
Related parts for FC0H105ZFTBR44-SS
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FC0H104ZFTBR24 | KEMET | CAP 100MF -20% +80% 5.5V SMD | Inquiry |
 |
EEC-EN0F204B | Panasonic Electronic Components | CAP 200MF -20% +80% 3.3V SMD | Inquiry |
 |
JJL0E178MSEF | Nichicon | CAP 1700F 2.5V 20% CHASSIS MOUNT | Inquiry |
 |
106DCN2R7M | Illinois Capacitor | CAP 10F 20% 2.7V T/H | Inquiry |
 |
MAL219691266E3 | Vishay BC Components | CAP ALUM 15F 8.4V SNAP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers