BYCHIPS is the stocking distributor for FBA04HA600KD-00, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FBA04HA600KD-00 by email, we will give you a best price according your plan.
Buy FBA04HA600KD-00 with BYCHPS
Buy with guarantee
FBA04HA600KD-00
- Part Number:
- FBA04HA600KD-00
- Manufacturer:
- Taiyo Yuden
- Description:
- FERRITE BEAD 60 OHM AXIAL 1LN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12811 Pieces
- Data sheet:
- FBA04HA600KD-00.pdf
Introduction
Specifications
| Size / Dimension: | 0.138" Dia x 0.236" L (3.50mm x 6.00mm) |
|---|---|
| Series: | FB |
| Ratings: | - |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Other Names: | FB FBA04HA600KD-00 |
| Operating Temperature: | -25°C ~ 85°C |
| Number of Lines: | 1 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | FBA04HA600KD-00 |
| Impedance @ Frequency: | 60 Ohm @ 50MHz |
| Height (Max): | - |
| Filter Type: | - |
| Description: | FERRITE BEAD 60 OHM AXIAL 1LN |
| DC Resistance (DCR) (Max): | 10 mOhm |
| Current Rating (Max): | 7A |
| Email: | [email protected] |
Related parts for FBA04HA600KD-00
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FBA04HA600BB-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600BA-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600NA-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600KE-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600AB-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600VB-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600KF-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
|
FBA04HA600VS-00 | Taiyo Yuden | FERRITE BEAD 60 OHM AXIAL 1LN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers