BYCHIPS is the stocking distributor for F5QB881M5P2BG-J, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for F5QB881M5P2BG-J by email, we will give you a best price according your plan.
Buy F5QB881M5P2BG-J with BYCHPS
Buy with guarantee
F5QB881M5P2BG-J
- Part Number:
- F5QB881M5P2BG-J
- Manufacturer:
- Taiyo Yuden
- Description:
- FILTER SAW 881.5MHZ W-CDMA V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17938 Pieces
- Data sheet:
- F5QB881M5P2BG-J.pdf
Introduction
Specifications
| Size / Dimension: | 0.043" L x 0.035" W (1.10mm x 0.90mm) |
|---|---|
| Series: | F5 |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 5-SMD, No Lead |
| Other Names: | 587-3005-2 F5QB881M5P2BGJ FAR-F5QB-881M50-P2BG-J PJ F5QB881M5P2BG-J |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | F5QB881M5P2BG-J |
| Insertion Loss: | 1.5dB |
| Height (Max): | 0.020" (0.50mm) |
| Frequency - Center: | 881.5MHz |
| Description: | FILTER SAW 881.5MHZ W-CDMA V |
| Bandwidth: | 25MHz |
| Applications: | Cellular, WCDMA |
| Email: | [email protected] |
Related parts for F5QB881M5P2BG-J
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
B39182B9488P810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW | Inquiry |
|
B39162B7840C710A3 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 1.57542GHZ 5SMD | Inquiry |
 |
F4052 | EPCOS (TDK) | FILTER 4-POLE 2.339GHZ SMD | Inquiry |
 |
B39321B3763Z810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 315.15MHZ REMOTE SMD | Inquiry |
|
B39381B4237U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | LOW LOSS 380.0 MHZ | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers