BYCHIPS is the stocking distributor for F03B250V2-1-2A, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for F03B250V2-1-2A by email, we will give you a best price according your plan.
Buy F03B250V2-1-2A with BYCHPS
Buy with guarantee
F03B250V2-1-2A
- Part Number:
- F03B250V2-1-2A
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSE GOVT 250V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13551 Pieces
- Data sheet:
- F03B250V2-1-2A.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Other Names: | F03B250V2-1/2A |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | F03B250V2-1-2A |
| Description: | FUSE GOVT 250V |
| Email: | [email protected] |
Related parts for F03B250V2-1-2A
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
F03B250V2A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V3A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-8A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V3-4A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-1-4A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-1-2A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V3-10A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V3-8A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-10A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-6-10A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-4A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V8-10A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V3-2-10A | Eaton | FUSE GOVT 250V | Inquiry |
|
F03B250V1-2A | Eaton | FUSE GOVT 250V | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers