BYCHIPS is the stocking distributor for ESR03EZPJ564, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ESR03EZPJ564 by email, we will give you a best price according your plan.
Buy ESR03EZPJ564 with BYCHPS
Buy with guarantee
ESR03EZPJ564
- Part Number:
- ESR03EZPJ564
- Manufacturer:
- LAPIS Semiconductor
- Description:
- RES SMD 560K OHM 5% 1/4W 0603
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15450 Pieces
- Data sheet:
- ESR03EZPJ564.pdf
Introduction
Specifications
| Tolerance: | ±5% |
|---|---|
| Temperature Coefficient: | ±200ppm/°C |
| Supplier Device Package: | 0603 |
| Size / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Series: | ESR |
| Resistance (Ohms): | 560k |
| Power (Watts): | 0.25W, 1/4W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0603 (1608 Metric) |
| Other Names: | RHM560KDTR |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | ESR03EZPJ564 |
| Height - Seated (Max): | 0.022" (0.55mm) |
| Features: | Automotive AEC-Q200, Pulse Withstanding |
| Failure Rate: | - |
| Expanded Description: | 560k Ohm ±5% 0.25W, 1/4W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200, Pulse Withstanding Thick Film |
| Description: | RES SMD 560K OHM 5% 1/4W 0603 |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for ESR03EZPJ564
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog