BYCHIPS is the stocking distributor for ESH685M063AC3AA, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ESH685M063AC3AA by email, we will give you a best price according your plan.
Buy ESH685M063AC3AA with BYCHPS
Buy with guarantee
ESH685M063AC3AA
- Part Number:
- ESH685M063AC3AA
- Manufacturer:
- KEMET
- Description:
- CAP ALUM 6.8UF 20% 63V RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16056 Pieces
- Data sheet:
- ESH685M063AC3AA.pdf
Introduction
Specifications
| Voltage Rating: | 63V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.197" Dia (5.00mm) |
| Series: | ESH |
| Ripple Current: | 37mA @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 399-6099 |
| Operating Temperature: | -40°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | ESH685M063AC3AA |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 0.079" (2.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 0.492" (12.50mm) |
| Expanded Description: | 6.8µF 63V Aluminum Capacitors Radial, Can 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 6.8UF 20% 63V RADIAL |
| Capacitance: | 6.8µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ESH685M063AC3AA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog