BYCHIPS is the stocking distributor for ESDA8V2-1MX2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ESDA8V2-1MX2 by email, we will give you a best price according your plan.
Buy ESDA8V2-1MX2 with BYCHPS
Buy with guarantee
ESDA8V2-1MX2
- Part Number:
- ESDA8V2-1MX2
- Manufacturer:
- ST
- Description:
- TVS DIODE 5VWM 18.5VC 2QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17477 Pieces
- Data sheet:
- ESDA8V2-1MX2.pdf
Introduction
Specifications
| Voltage - Reverse Standoff (Typ): | 5V |
|---|---|
| Voltage - Clamping (Max) @ Ipp: | 18.5V |
| Voltage - Breakdown (Min): | 8.2V |
| Unidirectional Channels: | 1 |
| Type: | Zener |
| Supplier Device Package: | 2-µQFN (1.45x1.0) |
| Series: | ESDA, TRANSIL™ |
| Power Line Protection: | No |
| Power - Peak Pulse: | 500W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2-UFDFN |
| Other Names: | 497-10558-2 ESDA8V2-1MX2-ND ESDA8V21MX2 |
| Operating Temperature: | -40°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | ESDA8V2-1MX2 |
| Description: | TVS DIODE 5VWM 18.5VC 2QFN |
| Current - Peak Pulse (10/1000µs): | 27A (8/20µs) |
| Capacitance @ Frequency: | 350pF @ 1MHz |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ESDA8V2-1MX2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers