BYCHIPS is the stocking distributor for ESD5V3S1B02LRHE6327XTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ESD5V3S1B02LRHE6327XTSA1 by email, we will give you a best price according your plan.
Buy ESD5V3S1B02LRHE6327XTSA1 with BYCHPS
Buy with guarantee
ESD5V3S1B02LRHE6327XTSA1
- Part Number:
- ESD5V3S1B02LRHE6327XTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- TVS DIODE 5.3VWM 13VC TSLP2-17
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18783 Pieces
- Data sheet:
- ESD5V3S1B02LRHE6327XTSA1.pdf
Introduction
Specifications
| Voltage - Reverse Standoff (Typ): | 5.3V (Max) |
|---|---|
| Voltage - Clamping (Max) @ Ipp: | 13V |
| Voltage - Breakdown (Min): | 6V |
| Type: | Zener |
| Supplier Device Package: | PG-TSLP-2 |
| Series: | - |
| Power Line Protection: | No |
| Power - Peak Pulse: | 80W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SOD-882 |
| Other Names: | ESD5V3S1B-02LRH E6327 ESD5V3S1B-02LRH E6327INTR ESD5V3S1B-02LRH E6327INTR-ND ESD5V3S1B02LRHE6327 SP000558068 |
| Operating Temperature: | -55°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | ESD5V3S1B02LRHE6327XTSA1 |
| Description: | TVS DIODE 5.3VWM 13VC TSLP2-17 |
| Current - Peak Pulse (10/1000µs): | 5.5A (8/20µs) |
| Capacitance @ Frequency: | 17.5pF @ 1MHz |
| Bidirectional Channels: | 1 |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ESD5V3S1B02LRHE6327XTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers