BYCHIPS is the stocking distributor for ESD3V3D7-TP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ESD3V3D7-TP by email, we will give you a best price according your plan.
Buy ESD3V3D7-TP with BYCHPS
Buy with guarantee
ESD3V3D7-TP
- Part Number:
- ESD3V3D7-TP
- Manufacturer:
- Micro Commercial Components (MCC)
- Description:
- TVS DIODE 3.3VWM 11.9VC SOD723
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12807 Pieces
- Data sheet:
- ESD3V3D7-TP.pdf
Introduction
Specifications
| Voltage - Reverse Standoff (Typ): | 3.3V |
|---|---|
| Voltage - Clamping (Max) @ Ipp: | 11.9V |
| Voltage - Breakdown (Min): | 5V |
| Unidirectional Channels: | 1 |
| Type: | Zener |
| Supplier Device Package: | SOD-723 |
| Series: | - |
| Power Line Protection: | No |
| Power - Peak Pulse: | 113W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SOD-723 |
| Other Names: | ESD3V3D7-TPMSTR ESD3V3D7TP |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | ESD3V3D7-TP |
| Description: | TVS DIODE 3.3VWM 11.9VC SOD723 |
| Current - Peak Pulse (10/1000µs): | - |
| Capacitance @ Frequency: | 80pF @ 1MHz |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ESD3V3D7-TP
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers