BYCHIPS is the stocking distributor for EPF10K200SBC600-3B, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPF10K200SBC600-3B by email, we will give you a best price according your plan.
Buy EPF10K200SBC600-3B with BYCHPS
Buy with guarantee
EPF10K200SBC600-3B
- Part Number:
- EPF10K200SBC600-3B
- Manufacturer:
- Altera (Intel)
- Description:
- IC FPGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16449 Pieces
- Data sheet:
- EPF10K200SBC600-3B.pdf
Introduction
Specifications
| Voltage - Supply: | 2.375 V ~ 2.625 V |
|---|---|
| Total RAM Bits: | 98304 |
| Supplier Device Package: | 600-BGA (45x45) |
| Series: | FLEX-10KS® |
| Package / Case: | 600-BGA |
| Operating Temperature: | 0°C ~ 70°C (TA) |
| Number of Logic Elements/Cells: | 9984 |
| Number of LABs/CLBs: | 1248 |
| Number of I/O: | 470 |
| Number of Gates: | 513000 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | EPF10K200SBC600-3B |
| Description: | IC FPGA |
| Email: | [email protected] |
Related parts for EPF10K200SBC600-3B
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EPF10K200SBC672-2X | Altera | IC FPGA | Inquiry |
 |
EPF10K200SBC600-1 | Altera | IC FPGA 470 I/O 600BGA | Inquiry |
|
EPF10K200SBC600-1X | Altera | IC FPGA 470 I/O 600BGA | Inquiry |
|
EPF10K200SBC600-2X | Altera | IC FPGA 470 I/O 600BGA | Inquiry |
|
EPF10K200SBC600-3 | Altera | IC FPGA 470 I/O 600BGA | Inquiry |
|
EPF10K200EFC672-1 | Altera | IC FPGA 470 I/O 672FBGA | Inquiry |
|
EPF10K200SBC600-2 | Altera | IC FPGA 470 I/O 600BGA | Inquiry |
|
EPF10K200SBC672-1X | Altera | IC FPGA | Inquiry |
 |
EPF10K200SRC240-3N | Altera | IC FPGA 182 I/O 240RQFP | Inquiry |
 |
EPF10K200EGI599-3 | Altera | IC FPGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers