BYCHIPS is the stocking distributor for EP1K30TC144-2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EP1K30TC144-2 by email, we will give you a best price according your plan.
Buy EP1K30TC144-2 with BYCHPS
Buy with guarantee
EP1K30TC144-2
- Part Number:
- EP1K30TC144-2
- Manufacturer:
- Altera (Intel)
- Description:
- IC FPGA 102 I/O 144TQFP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 13386 Pieces
- Data sheet:
- 1.EP1K30TC144-2.pdf2.EP1K30TC144-2.pdf
Introduction
Specifications
| Voltage - Supply: | 2.375 V ~ 2.625 V |
|---|---|
| Total RAM Bits: | 24576 |
| Supplier Device Package: | 144-TQFP (20x20) |
| Series: | ACEX-1K® |
| Package / Case: | 144-LQFP |
| Other Names: | 544-1066 EP1K30TC1442 |
| Operating Temperature: | 0°C ~ 70°C (TA) |
| Number of Logic Elements/Cells: | 1728 |
| Number of LABs/CLBs: | 216 |
| Number of I/O: | 102 |
| Number of Gates: | 119000 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | EP1K30TC144-2 |
| Description: | IC FPGA 102 I/O 144TQFP |
| Email: | [email protected] |
Related parts for EP1K30TC144-2
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EP1K30TC144-3 | Altera | IC FPGA 102 I/O 144TQFP | Inquiry |
|
EP1K30TC144-2N | Altera | IC FPGA 102 I/O 144TQFP | Inquiry |
|
EP1K30TC144-3N | Altera | IC FPGA 102 I/O 144TQFP | Inquiry |
|
EP1K30TC144-1 | Altera | IC FPGA 102 I/O 144TQFP | Inquiry |
 |
EP1K30QI208-2 | Altera | IC FPGA 147 I/O 208QFP | Inquiry |
 |
EP1K30FC256-3AA | Altera | IC FPGA | Inquiry |
|
EP1K30TC144-1N | Altera | IC FPGA 102 I/O 144TQFP | Inquiry |
|
EP1K30FC256-2 | Altera | IC FPGA 171 I/O 256FBGA | Inquiry |
|
EP1K30QI208-2N | Altera | IC FPGA 147 I/O 208QFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers